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Mobile Application Processor
- 40nm , 9mm x 9mm
- A11 based dual core system
- IO and memory subsystems
- Fullchip planning and integration
- Power and area optimization
- ARM Core hardening
- Timing budgeting
- IO ring design , bump planning and packaging interactions
- Foundry interaction and ATE bring up
24 Core Network Processor
- 65nm, 25mm X 25mm
- 4 distinct network processors (Xtensa) instantiated 24 times
- Large chip with complex NoC
- Frequency and power optimization
- Complex thermal and packaging solution
- Interaction with Foundry , Packaging and testing partners
- Delivering of successful engineering samples